Design Analysis Technology

Our company utilizes CAE (Computer Aided Engineering) tools to replace the fabrication and testing of physical prototypes with computer simulations, thereby shortening development time and reducing costs. In addition, by simulating phenomena that are difficult to reproduce in the real world, we enhance product safety and reliability, enabling the design of higher-quality products. Our CAE analyses cover a broad range of areas including electrical signals, electromagnetic fields, acoustics, structural mechanics, thermal analysis, and optics. By comparing simulation results with feedback from prototype verifications, we continuously improve simulation accuracy. Beyond product design, CAE is also used in advanced development prototypes and quality verification, with the acquired expertise shared within the company as valuable technical assets.

Below are some examples of our CAE initiatives.

EMC (Electromagnetic Compatibility) refers to the ability of electronic devices to operate without causing or suffering from electromagnetic interference. It is a technology designed to prevent electronic equipment from interfering with other devices or being affected by such interference. Our company utilizes advanced 3D EMC analysis technology to calculate the electromagnetic fields around the product’s shape and its surroundings. This allows us to analyze and design for noise emissions and susceptibility to external electromagnetic noise, taking into account the characteristics of 3D structures.

The example analysis illustrates a noise analysis case for a product, where the electric field distribution on a printed circuit board inside the product is analyzed to identify the cause and degree of radiated electromagnetic noise.

Our company conducts various acoustic analyses to optimize spatial sound field design and improve the sound quality of audio devices. The example analysis below illustrates acoustic analysis inside a vehicle cabin, where accurate interior structures such as upholstery and seats are reproduced through 3D scanning to enable high-precision understanding and examination of sound field phenomena. Additionally, as an example of acoustic analysis for vehicle-mounted speakers, it shows a structural study of the diffuser in the center of the speaker, which controls sound directivity.

In addition to solid-state heat conduction, our company conducts thermal-fluid analysis that simulates fluid (gas or liquid) flow and heat transfer. This allows us to perform comprehensive thermal design of entire systems, including heat dissipation and cooling structure analysis, as well as printed circuit board thermal analysis.

The example analysis below shows thermal analysis of an in-vehicle device. By analyzing temperature and flow velocity inside the enclosure under our specified temperature rise test conditions, we achieve comprehensive optimal design of the enclosure structure, component materials, heat dissipation mechanisms, and printed circuit board component layout.

Our company conducts structural analysis including linear structural analysis, which covers stress distribution and elastic deformation, as well as nonlinear structural analysis that accounts for large deformations and contact. Nonlinear structural analysis allows for more accurate simulation of complex physical phenomena, enabling reliable design and product development.

The example analysis below shows nonlinear structural analysis of a transceiver, illustrating deformation behavior of the battery terminal and waterproof rubber under external forces.

Our company utilizes CAE in optical design for camera lenses and projector projection systems, enabling the development of compact, high-quality products. The example below demonstrates analysis of a projector’s optical system, where unwanted light such as fine scattered light at the edges of optical components and stray reflections caused by multiple internal reflections within the projection lens are analyzed to achieve high-contrast image reproduction. Additionally, the design optimization of a light guide plate, which guides LED light in display operation panels like navigation systems, is conducted to ensure uniform illumination.